METHOD FOR MANUFACTURING LAMINATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

To provide a method for manufacturing a laminate having excellent adhesiveness between a resin layer and another resin layer or between a resin layer and a metal layer, and a semiconductor device including the above method.SOLUTION: A method for manufacturing a laminate includes: a photosensitive re...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	STEFAN VANCLOOSTER, IWAI HISASHI, ITO KATSUSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide a method for manufacturing a laminate having excellent adhesiveness between a resin layer and another resin layer or between a resin layer and a metal layer, and a semiconductor device including the above method.SOLUTION: A method for manufacturing a laminate includes: a photosensitive resin composition layer formation step of applying a photosensitive resin composition to a substrate to form a layer state; a step of exposing the photosensitive resin composition layer to light; a step of performing negative development on the exposed photosensitive resin composition layer; a step of forming a metal layer on a surface of the photosensitive resin composition layer after the development; and a surface activation process step of performing a surface activation process on the metal layer and at least a portion of the photosensitive resin composition layer. The method further includes again successively performing the photosensitive resin composition layer formation step, the exposure step, and the development step.SELECTED DRAWING: None 【課題】樹脂層と樹脂層、または、樹脂層と金属層の密着性に優れた積層体の製造方法、ならびに、製造方法を含む半導体デバイスを提供する。【解決手段】感光性樹脂組成物を基板に適用して層状にする、感光性樹脂組成物層形成工程と、感光性樹脂組成物層を露光する工程と、露光された感光性樹脂組成物層に対して、ネガ型現像処理を行う工程と、現像処理後の感光性樹脂組成物層の表面に金属層を形成する工程と、金属層及び感光性樹脂組成物層の少なくとも一部を表面活性化処理する表面活性化処理工程を含み、再度、感光性樹脂組成物層形成工程、露光工程、および、現像処理工程を、順に行うことを含む積層体の製造方法。【選択図】なし