CHEMICALLY POLISHED COMPOSITION AND METHOD FOR PRODUCING METAL MATERIAL

To provide a chemically polished composition for local chemical polishing.SOLUTION: A chemically polished composition contains (1) hydrochloric acid, (2) phosphoric acid, (3) hydrogen peroxide, and (4) polysaccharide thickener.SELECTED DRAWING: None 【課題】局地的な化学研磨を行なう化学研磨処理組成物を提供すること。【解決手段】化学研磨処理組成物であ...

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Hauptverfasser:	SHINOZAKI KAZUYUKI, NAGASAWA SOHEI, KATORI MITSUOMI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
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Beschreibung
Zusammenfassung:	To provide a chemically polished composition for local chemical polishing.SOLUTION: A chemically polished composition contains (1) hydrochloric acid, (2) phosphoric acid, (3) hydrogen peroxide, and (4) polysaccharide thickener.SELECTED DRAWING: None 【課題】局地的な化学研磨を行なう化学研磨処理組成物を提供すること。【解決手段】化学研磨処理組成物であって、（１）塩酸（２）リン酸（３）過酸化水素、及び、（４）多糖類増粘剤を含有する化学研磨処理組成物。【選択図】なし