HIGH DURABILITY SOLDER TERMINAL

To reduce a maximum inelastic strain value of a solder bond pad.SOLUTION: An electronic device package includes a lower surface for conducting electronic signals, a first solder bond pad having first size disposed on the lower surface, and a plurality of second solder bond pads having second size sm...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAJI TORU, YASHIRO YUJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To reduce a maximum inelastic strain value of a solder bond pad.SOLUTION: An electronic device package includes a lower surface for conducting electronic signals, a first solder bond pad having first size disposed on the lower surface, and a plurality of second solder bond pads having second size smaller than the first size disposed on the lower surface and surrounding the first solder bond pad.SELECTED DRAWING: Figure 12A 【課題】はんだ接合パッドの最大非弾性歪み値を低減する。【解決手段】電子デバイスパッケージが、電子信号を導通させる下面と、当該下面に配置された第１サイズを有する第１はんだ接合パッドと、当該下面に配置されて第１はんだ接合パッドを取り囲む第１サイズよりも小さな第２サイズを有する複数の第２はんだ接合パッドとを含む。【選択図】図１２Ａ