ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

To increase the vibration resistance of an electronic component and to enhance a heat dissipation property of an electronic component.SOLUTION: An electronic component comprises: a magnetic body 4 having a hollow part; a conductor 6 extending through the hollow part of the magnetic body 4 and protru...

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Bibliographische Detailangaben
Hauptverfasser: MATSUOKA TAKASHI, KAMIYAMA NOZOMI, KOSEKI YOSHIYA, SUEMATSU SHUNZO, HATAE TATSURU, NAGAHARA KAZUHIRO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To increase the vibration resistance of an electronic component and to enhance a heat dissipation property of an electronic component.SOLUTION: An electronic component comprises: a magnetic body 4 having a hollow part; a conductor 6 extending through the hollow part of the magnetic body 4 and protruding from the hollow part; a dielectric layer 30 formed on a surface of the conductor 6; a solid electrolyte layer 32-2 formed on a surface of the dielectric layer 30; a lead layer electrically connected to the solid electrolyte layer 32-2; and a resin 8 disposed between the magnetic body 4 and the conductor 6 and put in contact with the magnetic body 4 and the conductor 6.SELECTED DRAWING: Figure 3 【課題】電子部品の耐振性を高めること、および電子部品の放熱性を向上させる。【解決手段】中空部を有する磁性体4と、磁性体4の中空部を貫通し、中空部から突出する導体6と、導体6の表面に形成されている誘電体層30と、誘電体層30の表面に形成されている固体電解質層32−2と、固体電解質層32−2に電気的に接続されている引出層と、磁性体4と導体6との間に配置されるとともに磁性体4および導体6に接触する樹脂8を備える。【選択図】図3