SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
To provide a technique for reducing the amount of gas required to maintain the dissolved gas concentration of a processing liquid discharged from a nozzle.SOLUTION: A substrate processing apparatus 1 includes a nozzle 12 that discharges a processing liquid toward a substrate W held inside each proce...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a technique for reducing the amount of gas required to maintain the dissolved gas concentration of a processing liquid discharged from a nozzle.SOLUTION: A substrate processing apparatus 1 includes a nozzle 12 that discharges a processing liquid toward a substrate W held inside each processing chamber 10, a processing liquid pipe 101 that is connected to the nozzle 12 and circulates the processing liquid A inside, a gas pipe 103 that circulates nitrogen gas inside, a fluid box 7 into which the processing liquid pipe 101 and the gas pipe 103 are loaded, and a multiple valve 23 that connects the gas pipe to an intermediate portion between the inside of the fluid box 7 and the nozzle 12 in the processing liquid pipe 101. A processing liquid A in which the nitrogen gas is dissolved is discharged from the nozzle 12 by mixing the processing liquid A with the nitrogen gas in the multiple valve 23.SELECTED DRAWING: Figure 2
【課題】ノズルから吐出される処理液のガス溶存濃度の維持に必要なガスの量を低減する技術を提供する。【解決手段】基板処理装置1は、各処理室10の内部に保持された基板Wに向けて処理液を吐出するノズル12、ノズル12に接続されており内部に処理液Aを流通させる処理液配管101、内部に窒素ガスを流通させる103、処理液配管101およびガス配管103が装填される流体ボックス7、処理液配管101における流体ボックス7の内部からノズル12までの間の中間部に前記ガス配管を接続させる多連弁23を含む。多連弁23において処理液Aに窒素ガスが混合されることによって、窒素ガスを溶存させた処理液Aがノズル12から吐出される。【選択図】図2 |
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