FPIC FILM, FLEXIBLE PRINTED CIRCUIT BOARD HAVING THE SAME, AND MANUFACTURING METHOD THEREOF

To provide an FPIC film and a manufacturing method thereof, and more specifically, an FPIC film excellent in developability and also in hole plugging and bendability, and a manufacturing method thereof, which facilitate the manufacture of a flexible printed circuit board.SOLUTION: An FPIC film is a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KIM SEONG GEUN, KIM HYUNG MIM, KWEON JEONGMIN, YOO SUNG JU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PAINTS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide an FPIC film and a manufacturing method thereof, and more specifically, an FPIC film excellent in developability and also in hole plugging and bendability, and a manufacturing method thereof, which facilitate the manufacture of a flexible printed circuit board.SOLUTION: An FPIC film is a cured product of a photosensitive adhesive resin in the B-stage state. The photosensitive adhesive resin comprises an alkali-soluble and non-photosensitive polyimide resin, a photocurable acryl oligomer, and an acryl oligomer that binds to a carboxyl group of the polyimide and imparts UV reactivity.SELECTED DRAWING: Figure 1 【課題】ＦＰＩＣフィルム及びその製造方法に関し、現像性に優れているだけでなく、ホールプラッギング（ｈｏｌｅｐｌｕｇｇｉｎｇ）性及び曲げ成形性（ｂｅｎｄａｂｉｌｉｔｙ）に優れたＦＰＩＣフィルム及びその製造方法に関する。さらに、フレキシブルプリント配線板の製造を容易とするものである。【解決手段】感光性接着樹脂のＢ−ステージ状態の硬化物であり、感光性接着樹脂は、アルカリ可溶性及び非感光性ポリイミド樹脂、光硬化性のアクリルオリゴマー、及びポリイミドのカルボキシル基に結合し、ＵＶ反応性を付与するアクリルオリゴマーを含むことを特徴とするＦＰＩＣフィルムである。【選択図】図１