POLISHING DEVICE AND POLISHING METHOD

To prevent such a situation that chip powder flying from a rotating grind stone for cutting a slab and a surface of a steel material is adhesively accumulated in a device, in a polishing device.SOLUTION: In a polishing device for polishing a surface of a slab B, a protection plate 40 is installed on a portion with which chip powder D with a high temperature flying from a point at which a rotating grind stone 24 cuts the slab S collides. A material of the protection plate 40 is formed of stainless steel whose softening temperature is 870°C or higher. The chip powder D is received by the protection plate 40, and falls without adhering and being accumulated on a surface of the protection plate 40.SELECTED DRAWING: Figure 4 【課題】研削装置において、鋼片や鋼材の表面を切削する回転砥石から飛来する切削粉が装置内に付着、堆積することを防止する。【解決手段】スラブＳ表面の研削を行う研削装置において、回転砥石２４がスラブＳを切削している個所から飛散する高温の切削粉Ｄが衝突する部分に、防護板４０を設置する。防護板４０の材質は、軟化温度が８７０℃以上のステンレス鋼からなる。切削粉Ｄは、防護板４０によって受け止められ、防護板４０の表面に付着、堆積することなく落下する。【選択図】図４