METHOD FOR SELECTIVELY COATING ELECTRONIC COMPONENT WITH COATING MATERIAL, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
To provide a method for selectively coating an electronic component with a coating material, the method being capable of collectively coating a large quantity of element bodies with the coating material.SOLUTION: The present invention relates to a method for coating, with a coating material, only a...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; jpn |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | To provide a method for selectively coating an electronic component with a coating material, the method being capable of collectively coating a large quantity of element bodies with the coating material.SOLUTION: The present invention relates to a method for coating, with a coating material, only a surface material selected from among multiple surface materials of different qualities exposed on a surface of an element body. The method successively includes: an element body preparation step of defining a surface material to be coated with the coating material as a selective surface material and defining a surface material not to be coated with the coating material as a non-selective surface material, and then preparing an element body (laminated capacitor 1) in which the selective surface material (a component main body 2 made of ceramic) and the non-selective surface material (external electrodes 3a and 3b made of a metal) are exposed on a surface thereof; a surface modification step of applying a surface modifying agent (a silane coupling agent 4) to only a surface of the selective surface material of the surface of the element body; and a coating step of coating the surface of the selective surface material to which the surface modifying agent is applied, with the coating material (a polymer resin 7).SELECTED DRAWING: Figure 3
【課題】 大量の素体に一括して被覆素材を被覆させることが可能な、電子部品への被覆素材の選択的被覆方法を提供する。【解決手段】 素体の表面に露出された材質の異なる複数の表面素材の中から、選択した表面素材にのみ被覆素材を被覆させるものであって、被覆素材を被覆させる表面素材を選択表面素材、被覆素材を被覆させない表面素材を非選択表面素材と定義したうえで、表面に、選択表面素材(セラミックからなる部品本体2)と、非選択表面素材(金属からなる外部電極3a、3b)とが露出された素体(積層コンデンサ1)を準備する素体準備工程と、素体の表面のうち、選択表面素材の表面のみに表面修飾剤(シランカップリング剤4)を付与する表面修飾工程と、表面修飾剤が付与された選択表面素材の表面に、被覆素材(ポリマー樹脂7)を被覆させる被覆工程と、を順に備えたものとした。【選択図】 図3 |
---|