LIQUID DISCHARGE NOZZLE AND SEMICONDUCTOR MANUFACTURING DEVICE

To inhibit maintenance of a state in which a retention liquid adheres to an opening side of a nozzle, in a period when suction processing is performed.SOLUTION: A nozzle 10 has conductivity. The nozzle 10 has a structure X1 that decreases an adhesive force generated when a retention liquid existing...

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Bibliographische Detailangaben
Hauptverfasser:	IDA KOJI, ANABUKI KAZUTOSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY NOZZLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	To inhibit maintenance of a state in which a retention liquid adheres to an opening side of a nozzle, in a period when suction processing is performed.SOLUTION: A nozzle 10 has conductivity. The nozzle 10 has a structure X1 that decreases an adhesive force generated when a retention liquid existing on the opening H1b side of the nozzle 10 adheres to the opening H1b side of the nozzle 10, by making use of the conductivity, in a period when suction processing is performed.SELECTED DRAWING: Figure 2 【課題】吸引処理が行われる期間において、滞留液体がノズルの開口側に付着した状態が維持されることを抑制する。【解決手段】ノズル１０は、導電性を有する。ノズル１０は、吸引処理が行われる期間において、当該導電性を利用して、当該ノズル１０の開口Ｈ１ｂ側に存在する液体である滞留液体が、当該ノズル１０の当該開口Ｈ１ｂ側に付着する力である付着力を小さくする構造Ｘ１を有する。【選択図】図２