IMAGING MODULE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE

To increase the resistance of an imaging module to drop impact confining an appropriate amount of gas generated during a manufacturing process in a solder and forming a void portion in the solder.SOLUTION: An imaging module 300 includes a printed wiring board 100, an electronic component 105, a sold...

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Bibliographische Detailangaben
Hauptverfasser:	FUJISAWA YOSHITOMO, ISHIGURI SHINGO, HASEGAWA MITSUTOSHI, SAKAKI TAKASHI, MINEGISHI KUNIHIKO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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