PHOTOSENSITIVE RESIN LAMINATE FOR MICRO FLOW PASSAGE

To provide a photosensitive resin laminate for a micro flow passage device which has an excellent sealing property and has no flow passage blocking property and/or has an excellent waterproofness, and a sealing material for a micro flow passage device and a micro flow passage device using the photos...

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Bibliographische Detailangaben
Hauptverfasser:	NAGAI SHUSUKE, KOTANI YUZO, FURUYA SHUNSUKE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MATERIALS THEREFOR MEASURING ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a photosensitive resin laminate for a micro flow passage device which has an excellent sealing property and has no flow passage blocking property and/or has an excellent waterproofness, and a sealing material for a micro flow passage device and a micro flow passage device using the photosensitive resin laminate as a dry film.SOLUTION: The photosensitive resin laminate for a micro flow passage device includes a supporting film and a photosensitive resin composite layer, (1) the photosensitive resin composite layer having a film thickness of 1-15 μm and having a melt viscosity of 100,000 mPa s or smaller at 70°C, and (2) the rate I/O of an inorganic value (I) and an organic value (O) of the photosensitive resin composite layer being not larger than 1.0.SELECTED DRAWING: None 【課題】本発明が解決しようとする課題は、流路閉塞性がなくシール性が良好であるか、かつ／又は耐水性に優れるマイクロ流路デバイス用感光性樹脂積層体と、それをドライフィルムとして用いるマイクロ流路デバイス用シール材及びマイクロ流路デバイスとを提供することである。【解決手段】マイクロ流路デバイス用感光性樹脂積層体が、支持フィルムと感光性樹脂組成物層を含み、（１）感光性樹脂組成物層の膜厚が１〜１５μｍであり、かつ感光性樹脂組成物の７０℃での溶融粘度が１００，０００ｍＰａ・ｓ以下であるか、又は（２）感光性樹脂組成物層の無機性値（Ｉ）と有機性値（Ｏ）との比Ｉ／Ｏが１．０以下である。【選択図】なし