POLISHING COMPOSITION, KIT FOR PREPARING POLISHING COMPOSITION, AND MANUFACTURING METHOD OF MAGNETIC DISK SUBSTRATE

POLISHING COMPOSITION, KIT FOR PREPARING POLISHING COMPOSITION, AND MANUFACTURING METHOD OF MAGNETIC DISK SUBSTRATE

To provide a polishing composition capable of facilitating detecting minute defects of a magnetic disk substrate after polishing at good accuracy, a kit for preparing the polishing composition used for preparing the polishing composition, and a manufacturing method of the magnetic disk substrate by...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YOKOMICHI NORITAKA, OYAMA TAKAHARU
Format: Patent
Sprache:eng ; jpn
Schlagworte:
ADHESIVES
CHEMISTRY
DRESSING OR CONDITIONING OF ABRADING SURFACES
DYES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PERFORMING OPERATIONS
PHYSICS
POLISHES
POLISHING
TRANSPORTING
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Beschreibung
Zusammenfassung:To provide a polishing composition capable of facilitating detecting minute defects of a magnetic disk substrate after polishing at good accuracy, a kit for preparing the polishing composition used for preparing the polishing composition, and a manufacturing method of the magnetic disk substrate by using the polishing composition.SOLUTION: There is provided a polishing composition used in a finish polishing process of a magnetic disk substrate, containing an abrasive grain dispersion in which an abrasive grain is dispersed in water, the abrasive grain contains a silica particle, and a relationship between most frequent diameter in a grain size distribution based on the number of the abrasive grain (D) and 95% cumulative diameter from a small diameter side (D) satisfies the following relational expression. 1.14≤(D/D)