SOLDER MATERIAL

To provide a solder material where the variation of mechanical characteristics is small even in an ultra-low temperature.SOLUTION: A solder material contains 0.5-less than 2.5% Ag (wt.%, hereinafter the same), 0.3-0.5% Cu, 5.5-6.4% In, 0.5-1.4% Sb and the balance Sn with inevitable impurities or 2.5...

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Bibliographische Detailangaben
Hauptverfasser:	MOROFUSHI HAYATO, HIRAI SUMIHIKO, OMORI KOKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	To provide a solder material where the variation of mechanical characteristics is small even in an ultra-low temperature.SOLUTION: A solder material contains 0.5-less than 2.5% Ag (wt.%, hereinafter the same), 0.3-0.5% Cu, 5.5-6.4% In, 0.5-1.4% Sb and the balance Sn with inevitable impurities or 2.5-3.3% Ag, 0.3-0.5% Cu, 2.5-less than 5.5% In, 0.5-1.4% Sb and the balance Sn with inevitable impurities and may contain 2.5-3.3% Ag, 0.3-0.5% Cu, 5.5-6.4% In, more than 1.4-3.4% Sb and the balance Sn with inevitable impurities. Any solder material does not substantially contain Bi.SELECTED DRAWING: Figure 4 【課題】はんだ材料の機械特性のバラツキを、極低温下であっても小さくする。【解決手段】はんだ材料は、０．５〜２．５％（重量％。以下同じ）未満のＡｇ、０．３〜０．５％のＣｕ、５．５〜６．４％のＩｎ、０．５〜１．４％のＳｂを含み、残部が不可避的不純物及びＳｎである。又は、２．５〜３．３％のＡｇ、０．３〜０．５％のＣｕ、２．５〜５．５％未満のＩｎ、０．５〜１．４％のＳｂを含み、残部が不可避的不純物及びＳｎである。２．５〜３．３％のＡｇ、０．３〜０．５％のＣｕ、５．５〜６．４％のＩｎ、１．４超〜３．４％のＳｂを含み、残部が不可避的不純物及びＳｎであってもよい。いずれのはんだ材料にも、Ｂｉは実質的に含まれていない。【選択図】図４