LIGHT-EMITTING DEVICE

To provide a light-emitting device with improved response speed and reduced heat effects.SOLUTION: A light-emitting device 1 according to an embodiment of the present invention includes an LED chip 6 as a light emitting element chip formed in a rectangular shape with a side of 100 μm or less in plan...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SEKI SATOMI, YAJIMA TAKAYOSHI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a light-emitting device with improved response speed and reduced heat effects.SOLUTION: A light-emitting device 1 according to an embodiment of the present invention includes an LED chip 6 as a light emitting element chip formed in a rectangular shape with a side of 100 μm or less in plan view, a board 7 on which the LED chip 6 is mounted, an annular frame 8 provided so as to protrude from the surface 7a of the board 7 and provided so as to surround the LED chip 6, and a sealing resin 9 that includes a quantum dot 10 that emits light by light from the LED chip 6, and covers the LED chip 6, and the thermal conductivity of the frame 8 is 1 W/m K or more, and the sealing resin 9 is provided so as to be in contact with the frame 8.SELECTED DRAWING: Figure 1 【課題】応答速度を高め、熱の影響を抑制した発光装置を提供する。【解決手段】本発明の一態様として、平面視で一辺が100μm以下の矩形状に形成された発光素子チップとしてのLEDチップ6と、LEDチップ6が搭載された基板7と、基板7の表面7aから突出するように設けられると共に、LEDチップ6を囲むように設けられた環状の枠体8と、LEDチップ6からの光により発光する量子ドット10を含み、LEDチップ6を覆う封止樹脂9と、を備え、枠体8の熱導電率が、1W/m・K以上であり、かつ、封止樹脂9は、枠体8に接触するように設けられている発光装置1を提供する。【選択図】図1