CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD

To provide a photosensitive curable resin composition and the like that has excellent resolution, in which cracks are less likely to be generated in a via hole opening after surface roughening treatment, and that is effective for forming an interlayer insulation layer with excellent adhesion to circ...

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Bibliographische Detailangaben
Hauptverfasser:	SHIMAMIYA AYUMI, YONEDA NAOKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	To provide a photosensitive curable resin composition and the like that has excellent resolution, in which cracks are less likely to be generated in a via hole opening after surface roughening treatment, and that is effective for forming an interlayer insulation layer with excellent adhesion to circuit conductors and insulation reliability between circuits.SOLUTION: A photosensitive curable resin composition and the like includes (A) an alkali-soluble resin, (B) a photopolymerization initiator, (C) a thermosetting compound, (D-1) an inorganic filler having an average particle size of 0.5 to 6 μm decomposed or dissolved by a roughening agent, and (D-2) a spherical inorganic filler that is not decomposed or dissolved by the roughening agent.SELECTED DRAWING: None 【課題】解像性に優れ、かつ、粗面化処理後にビアホール用開口部に亀裂が発生しにくい、回路導体との密着性および回路間の絶縁信頼性に優れた層間絶縁層を形成するのに有効な感光性の硬化性樹脂組成物等を提供する。【解決手段】（Ａ）アルカリ可溶性樹脂と、（Ｂ）光重合開始剤と、（Ｃ）熱硬化性化合物と、（Ｄ−１）粗化剤により分解または溶解する平均粒子径が０．５〜６μｍの無機フィラーと、（Ｄ−２）粗化剤により分解または溶解しない球状の無機フィラーと、を含むことを特徴とする硬化性樹脂組成物等である。【選択図】なし