CONDUCTIVE FINE PARTICLE DISPERSION
To provide a conductive fine particle dispersion that can achieve both low resistance and adhesion even when fired under a sintering temperature condition of 100°C or lower.SOLUTION: The conductive fine particle dispersion comprises silver fine particles, a compound having a nitrogen-containing hete...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | To provide a conductive fine particle dispersion that can achieve both low resistance and adhesion even when fired under a sintering temperature condition of 100°C or lower.SOLUTION: The conductive fine particle dispersion comprises silver fine particles, a compound having a nitrogen-containing heterocycle, and a dispersion medium. The compound having a nitrogen-containing heterocycle has two or more nitrogen atoms in at least one heterocycle, and has one or more alkoxy groups and/or alkoxysilyl groups in the molecule.SELECTED DRAWING: None
【課題】 １００℃以下の焼結温度条件で焼成された場合にも低抵抗値及び密着性を両立できる導電性微粒子分散体を提供する。【解決手段】 銀微粒子、含窒素ヘテロ環を有する化合物、及び、分散媒を含み、上記含窒素ヘテロ環を有する化合物は、少なくとも１つのヘテロ環内に２つ以上の窒素原子を有し、分子中にアルコキシ基及び／又はアルコキシシリル基を１つ以上有する。【選択図】 なし |
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