ROTATION ANGLE SENSOR AND MANUFACTURING METHOD FOR ROTATION ANGLE SENSOR

To suppress the rattling of a sensor IC attached to an attachment member.SOLUTION: A rotation angle sensor 10A includes a sensor IC 20A attached to an attachment member 30A. The attachment member includes connecting terminals 32-35 protruding upward from an attachment face 31 and positioning guides...

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Bibliographische Detailangaben
Hauptverfasser: ITO TAKESHI, KONO SADAYUKI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To suppress the rattling of a sensor IC attached to an attachment member.SOLUTION: A rotation angle sensor 10A includes a sensor IC 20A attached to an attachment member 30A. The attachment member includes connecting terminals 32-35 protruding upward from an attachment face 31 and positioning guides 36-38 for positioning the sensor IC at an attachment position 39 of the sensor IC together with the connecting terminals and protruding upward from the attachment face. The sensor IC includes a lead frame 21 on which an electronic circuit is mounted and an external packaging 22 for covering the electronic circuit. The lead frame 21 includes leads 211-214 and outside portions 215-217 disposed on the outer periphery of the external packaging 22. At least one of the outside portions of at least some of the leads includes an elastic structure. The sensor IC 20A is attached to the attachment member 30A in such a way that the outside portion 215 is pushed against the guide 36 by an elastic force emanated by the elastic structure and the leads 211-214 are joined to the connecting terminals 32-35.SELECTED DRAWING: Figure 1 【課題】取り付け部材に取り付けられたセンサICのガタつきを抑制する。【解決手段】回転角センサ10Aは取付部材30Aに取り付けられるセンサIC20Aを有す。取付部材は、取付面31から上方に突出する接続端子32〜35と、取付面から上方に突出し、センサICの取付位置39に接続端子とともにセンサICを位置決めするガイド36〜38とを有す。センサICは、電子回路が実装されるリードフレーム21と、電子回路を覆う外装22とを有す。リードフレーム21は、リード211〜214と、外装22の外周に配設される外設部分215〜217とを含む。リードと少なくとも一部の外設部分のうちの少なくとも一方は弾性構造を有す。センサIC20Aは、弾性構造が発する弾性力によって、外設部分215がガイド36に押し付けられ、リード211〜214が接続端子32〜35に接合されて、取付部材30Aに取り付けられている。【選択図】図1