RESIN MOLDING DEVICE, MOLDING DIE DEVICE, AND METHOD OF MANUFACTURING RESIN MOLDED PRODUCT

To suppress a deformation of a molded product due to molding pressure.SOLUTION: Provided is: a first mold 2 holding a first surface Wa of a molding object W1 provided with an electronic component Wx and having a concavity 2M for housing the electronic component Wx; a second mold 3 having a cavity 3C...

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Bibliographische Detailangaben
Hauptverfasser:	TANIGUCHI SHOICHI, HANASAKA SHUHO, GOTO TOMOYUKI, HANAZAKI MASANORI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	To suppress a deformation of a molded product due to molding pressure.SOLUTION: Provided is: a first mold 2 holding a first surface Wa of a molding object W1 provided with an electronic component Wx and having a concavity 2M for housing the electronic component Wx; a second mold 3 having a cavity 3C that is provided to face the first mold 2 and accommodates a resin material J; a support member 5 provided to be able to raise and lower in accordance with a height of the electronic component Wx housed in the concavity 2M; and a fixing mechanism 6 for fixing the support member 5 which is raised and lowered in accordance with the height of the electronic component Wx.SELECTED DRAWING: Figure 2 【課題】成形圧による成形対象物の変形を抑制する。【解決手段】電子部品Ｗｘが設けられた成形対象物Ｗ１の第１面Ｗａを保持し、電子部品Ｗｘを収容する凹部２Ｍを有する第１型２と、第１型２に対向して設けられ、樹脂材料Ｊを収容するキャビティ３Ｃを有する第２型３と、凹部２Ｍに収容された電子部品Ｗｘの高さに合わせて昇降可能に設けられた支持部材５と、電子部品Ｗｘの高さに合わせて昇降した状態の支持部材５を固定する固定機構６とを備える。【選択図】図２