SOLDER COMPOSITION FOR LASER SOLDERING AND ELECTRONIC SUBSTRATE

To provide a solder composition for laser soldering that can suppress sufficiently the generation of a solder ball in the case of performing laser soldering.SOLUTION: A solder composition for laser soldering has a flux composition containing (A) a rosin-based resin, (B) an activator, (C) a solvent a...

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Bibliographische Detailangaben
Hauptverfasser:	MIZUNO TAKEMI, YOSHIZAWA SHINJI, IWABUCHI MITSURU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	To provide a solder composition for laser soldering that can suppress sufficiently the generation of a solder ball in the case of performing laser soldering.SOLUTION: A solder composition for laser soldering has a flux composition containing (A) a rosin-based resin, (B) an activator, (C) a solvent and (D) a thixotropic agent, and (E) solder powder, the (A) component containing (A1) a polymerization rosin with a softening point of 130°C or higher, and an acid value of 200 mgKOH/g or less.SELECTED DRAWING: None 【課題】レーザーはんだ付けをする場合に、はんだボールの発生を十分に抑制できるレーザーはんだ付け用はんだ組成物を提供すること。【解決手段】本発明のレーザーはんだ付け用はんだ組成物は、（Ａ）ロジン系樹脂、（Ｂ）活性剤、（Ｃ）溶剤および（Ｄ）チクソ剤を含有するフラックス組成物と、（Ｅ）はんだ粉末とを含有し、前記（Ａ）成分が、（Ａ１）軟化点が１３０℃以上であり、かつ酸価が２００ｍｇＫＯＨ／ｇ以下である重合ロジンを含有することを特徴とするものである。【選択図】なし