SUBSTRATE HAVING EMBEDDED INTERCONNECT STRUCTURE

To provide a substrate having an embedded interconnect structure including a circuit capable of electrically connecting electronic components mounted on a board, which is high in reliability, may reduce costs, and improves power integrity properties.SOLUTION: A substrate having an embedded interconnect structure includes: an interconnect structure 120A including a circuit member 125 which includes a plurality of circuit layers 122 and a passive device 126 which is disposed in parallel with the circuit member and includes an external electrode 126P; and a printed circuit board 110A including an insulating layer 111b covering the interconnect structure, a wiring layer 112b disposed on the insulating layer, a wiring via 113b penetrating through at least a portion of the insulating layer and electrically connecting the wiring layer to an uppermost circuit layer among the circuit layers, and a wiring via 129 penetrating through at least a portion of the insulating layer 112a and electrically connecting the wiring layer 112b to the external electrode of the passive device. A top surface of the uppermost circuit layer, contacting the wiring layer, is coplanar with a top surface of the external electrode, contacting the wiring layer.SELECTED DRAWING: Figure 6 【課題】基板上に実装された電子部品を互いに電気的に連結する回路を含むインターコネクト連結構造体が内蔵され、信頼性が高く、コスト低減でき、パワーインテグリティ特性も改善する連結構造体内蔵基板を提供する。【解決手段】複数の回路層１２２を含む回路部材１２５及び回路部材と並んで配置され、外部電極１２６Ｐを有する受動素子１２６を含む連結構造体１２０Ａと、連結構造体を覆う絶縁層１１１ｂ、絶縁層上に配置された配線層１１２ｂ、絶縁層の少なくとも一部を貫通し、配線層を複数の回路層のうち最上側の回路層と電気的に連結する配線ビア１１３ｂ及び絶縁層１１２ａの少なくとも一部を貫通し、配線層１１２ａを受動素子の外部電極と電気的に連結する配線ビア１２９を含むプリント回路基板１１０Ａと、を含む。配線層と接する最上側の回路層の上面は、配線層と接する外部電極の上面と同一平面（Ｃｏｐｌａｎａｒ）をなす。【選択図】図６