FAN-OUT SEMICONDUCTOR PACKAGE

To provide a fan-out semiconductor package, excellent in heat dissipation characteristics, capable of improving warping and reliability issues and reducing a process cost.SOLUTION: The fan-out semiconductor package includes: a semiconductor chip having an active surface on which connection pads are...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE DOO HWAN, CHO TAE JE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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