LAMINATION MOLDING DEVICE AND LAMINATION MOLDING METHOD

To obtain a lamination molding device capable of suppressing the increase of production cost.SOLUTION: A lamination molding device 100 comprises: a vacuum chamber 1; a work bed 4 having a work table 41 provided at the inside of the vacuum chamber 1 and capable of adjusting a height in a vertical dir...

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Hauptverfasser: MARUKO TAKAAKI, MONOTANE TAKESHI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To obtain a lamination molding device capable of suppressing the increase of production cost.SOLUTION: A lamination molding device 100 comprises: a vacuum chamber 1; a work bed 4 having a work table 41 provided at the inside of the vacuum chamber 1 and capable of adjusting a height in a vertical direction of forming the bottom face of a molding region R for molding a lamination molding M; a powder feed part 6 storing powder material 5 to be the raw material of the lamination molding M and feeding the raw material 5 to the molding region R; an electron gun 2 applying an electron beam EB for solidifying the powder material 5 to the molding region R; a shield member 7 provided at the inside of the vacuum chamber 1 and covering at least a part of the side face of a passage region S1 as a region through which the electron beam EB passes; and a gas feed part 8 feeding a gas cationized by the application of the electron beam EB into a gas feed space G as the space in which the side face of the passage region S1 is covered with the shield member 7.SELECTED DRAWING: Figure 1 【課題】生産コストの増加を抑制できる積層造形装置を得る。【解決手段】積層造形装置100は、真空チャンバ1と、真空チャンバ1内に設けられ、積層造形物Mを造形するための造形領域Rの底面を形成する垂直方向に高さを調節可能な作業テーブル41を有する作業土台4と、積層造形物Mの原料となる粉末材料5を貯留し、造形領域Rに粉末材料5を供給する粉末供給部6と、造形領域Rに、粉末材料5を固化させる電子ビームEBを照射する電子銃2と、真空チャンバ1内に設けられ、電子ビームEBが通過する領域である通過領域S1の側面の少なくとも一部を覆うシールド部材7と、通過領域S1の側面がシールド部材7によって覆われた空間であるガス供給空間G内に、電子ビームEBの照射によって陽イオン化するガスを供給するガス供給部8と、を備える。【選択図】図1