CONDUCTIVE HOT-MELT ADHESIVE COMPOSITION, AND LAMINATE

To provide a conductive hot-melt adhesive composition which can strongly bond adherends in a state of exhibiting high conductivity.SOLUTION: A conductive hot-melt adhesive composition contains a thermoplastic resin and a conductive filler, and has a volume resistivity of less than 1×10Ωcm and an ela...

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Bibliographische Detailangaben
1. Verfasser:	FUKUCHI YOSHIHISA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide a conductive hot-melt adhesive composition which can strongly bond adherends in a state of exhibiting high conductivity.SOLUTION: A conductive hot-melt adhesive composition contains a thermoplastic resin and a conductive filler, and has a volume resistivity of less than 1×10Ωcm and an elastic modulus of less than 5 MPa, in which the conductive filler is at least one selected from the group consisting of graphite, carbon black, carbon nanotube, graphene, graphene oxide, silver, copper, tin, zinc, zinc oxide, nickel, manganese and ITO.SELECTED DRAWING: Figure 1 【課題】本発明の目的は、高い導電性を発現した状態で被着体同士を強固に接着することができる導電性ホットメルト接着剤組成物を提供することにある。【解決手段】上記課題は、熱可塑性樹脂と導電性フィラーを含む導電性ホットメルト接着剤組成物であって、体積抵抗率が１×１０３Ωcm未満であって、弾性率が５ＭＰａ未満であることを特徴とする導電性ホットメルト接着剤組成物、また導電性フィラーが黒鉛、カーボンブラック、カーボンナノチューブ、グラフェン、酸化グラフェン、銀、銅、錫、亜鉛、酸化亜鉛、ニッケル、マンガン、およびＩＴＯからなる群より選ばれる少なくとも１種であることを特徴とする前記の導電性ホットメルト接着剤組成物によって解決される。【選択図】図１