POWER AMPLIFICATION MODULE

To prevent the safety from being compromised.SOLUTION: The power amplification module includes: a first substrate; and a second substrate located in a region overlapping with the first substrate at least partially, the second substrate including a first amplifier circuit and a second amplifier circu...

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Bibliographische Detailangaben
Hauptverfasser: KOYA SHIGEKI, OBE ISAO, TSUTSUI TAKAYUKI, SAITO YUICHI, UMEMOTO YASUNARI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To prevent the safety from being compromised.SOLUTION: The power amplification module includes: a first substrate; and a second substrate located in a region overlapping with the first substrate at least partially, the second substrate including a first amplifier circuit and a second amplifier circuit. The first substrate includes: a first transformer; a second transformer; and a plurality of first conductors lined between the first transformer and the second transformer, each extending from the wiring layer on a first main surface to the wiring layer on a second main surface of the substrate, the first transformer having a primary winding and a secondary winding, the primary winding having an end for receiving a signal and another end electrically connected to a reference potential, and the secondary winding having an end electrically connected to the input terminal of the first amplifier circuit and another end electrically connected to the input terminal of the second amplifier circuit, the second transformer having a primary winding and a secondary winding, the primary winding having an end electrically connected to the output terminal of the first amplifier circuit and another end electrically connected to the output terminal of the second amplifier circuit and the secondary winding having an end for outputting a signal and another end electrically connected to the reference potential.SELECTED DRAWING: Figure 4 【課題】安定性が損なわれることを抑制することを可能とする。【解決手段】第1基板と、少なくとも一部が第1基板と重なる領域に配置された第2基板と、を含む。第2基板は、第1増幅回路及び第2増幅回路を含む。第1基板は、一端に信号が入力され、他端が基準電位に電気的に接続された1次巻線と、一端が第1増幅回路の入力端子に電気的に接続され、他端が第2増幅回路の入力端子に電気的に接続された2次巻線と、を含む第1トランスと、一端が第1増幅回路の出力端子に電気的に接続され、他端が第2増幅回路の出力端子に電気的に接続された1次巻線と、一端から信号を出力し、他端が基準電位に電気的に接続された2次巻線と、を含む第2トランスと、第1トランスと第2トランスとの間に列をなして並んで形成され、各々が第1主面上の配線層から基板の第2主面上の配線層まで至る、複数の第1導体と、を含む。【選択図】図4