METHOD FOR PRODUCING RESIN PARTICLE, METHOD FOR PRODUCING CONDUCTIVE PARTICLE, METHOD FOR PRODUCING ANISOTROPIC CONDUCTIVE MATERIAL, AND METHOD FOR PRODUCING CONNECTION STRUCTURE
To provide a method for producing a resin particle that can be used even as a core of a conductive particle in an anisotropic conductive material of joining flexible substrates together, and even when used as the conductive particle, can yield a connection structure having excellent connection prope...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a method for producing a resin particle that can be used even as a core of a conductive particle in an anisotropic conductive material of joining flexible substrates together, and even when used as the conductive particle, can yield a connection structure having excellent connection properties.SOLUTION: A method for producing resin particles has a step of performing a polymerization reaction in a reaction container while stirring an emulsion containing seed particles and polymerizable monomers, to prepare resin particles, wherein, the polymerizable monomers containing a first (meth) acrylate monomer having a carbocyclic group or a heterocyclic group, and a second (meth) acrylate monomer not having a carbocyclic group or a heterocyclic group.SELECTED DRAWING: None
【課題】柔軟性を有する基板同士を接合する異方導電材料において導電性粒子のコアとしても用いることができ、導電性粒子として用いたときに接続特性に優れる接続構造体を得ることが可能な樹脂粒子の製造方法を提供すること。【解決手段】反応容器内でシード粒子及び重合性モノマーを含有する乳化液を撹拌しながら重合反応を行い、樹脂粒子を製造する工程を備え、重合性モノマーが、炭素環式基又は複素環式基を有する第1の(メタ)アクリレートモノマーと、炭素環式基又は複素環式基を有しない第2の(メタ)アクリレートモノマーと、を含む、樹脂粒子の製造方法。【選択図】なし |
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