SPACER FOR WAFER

To provide a spacer for wafer maintaining the form even if the thickness of a polyether ether ketone film is 30 μm or less, and can be manufactured and handled easily.SOLUTION: A spacer 20 for wafer interposed between an adsorber 1 and a semiconductor wafer 10 includes a bottom board 21 of plane rin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ASO TSUTOMU, SUDA NOBUMITSU, TAKISE SHIGERU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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