CURABLE RESIN COMPOSITION FOR INKJET AND PRINTED WIRING BOARD

To provide a curable resin composition for inkjet, capable of forming coating films of various colors, having excellent coatability by an inkjet method.SOLUTION: The curable resin composition for inkjet used for forming a solder resist film or marking on a printed wiring board, includes: (A) a (meth...

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Bibliographische Detailangaben
Hauptverfasser:	OKAMOTO YOSHIO, KUMAGAI KAZUHIKO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS LAKES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MORDANTS NATURAL RESINS ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	To provide a curable resin composition for inkjet, capable of forming coating films of various colors, having excellent coatability by an inkjet method.SOLUTION: The curable resin composition for inkjet used for forming a solder resist film or marking on a printed wiring board, includes: (A) a (meth) acrylic resin having a weight average molecular weight of 500 or more; (B) a photopolymerization initiator; (C) a reactive diluent; and (D) a dye.SELECTED DRAWING: None 【課題】様々な色調の塗膜を形成でき、インクジェット法での塗布性に優れるインクジェット用硬化性樹脂組成物を提供すること。【解決手段】本発明のインクジェット用硬化性樹脂組成物は、プリント配線基板上のソルダーレジスト膜またはマーキングを形成するために用いるインクジェット用硬化性樹脂組成物であって、（Ａ）重量平均分子量が５００以上の（メタ）アクリル系樹脂と、（Ｂ）光重合開始剤と、（Ｃ）反応性希釈剤と、（Ｄ）染料とを含有する。【選択図】なし