DIVIDING DEVICE AND DIVIDING METHOD

To provide a dividing device which can suppress occurrence of cut powder when a plate material is divided.SOLUTION: A trimming device 100 includes: a lower die 1 which is configured to be able to install a plate material 150 and is arranged in a molding portion 150a of the plate material 150; an upp...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HASHIMOTO TAKAHIRO, SAKAKIBARA NOBUYUKI, MIURA MASAYUKI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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