DEVICE AND METHOD FOR SUBSTRATE PROCESSING

To provide a technique which can suppress the pattern collapse of an uneven pattern in drying a liquid film which covers the uneven pattern.SOLUTION: A substrate processing device includes: a substrate holding unit which holds a substrate in a manner that the surface of the substrate having a formed uneven pattern faces upward; a liquid supply unit which supplies the substrate held by the substrate holding unit, with a processing liquid from above to thereby form a liquid film which covers the recess of the uneven pattern; a heating unit which includes a heater which locally heats the liquid film, and a heating position moving part which moves the heating position to be heated by the heater; and a heating control unit which controls the heating unit. While overlaying the heating position, when viewed in the vertical direction, with a boundary part between an exposed part in which the whole recess in the depth direction is exposed from the processing liquid, and a covered part in which the whole recess in the depth direction is filled with the processing liquid, the heating control unit moves the heating position in a direction in which the exposed part is expanded and a movement direction of the boundary part.SELECTED DRAWING: Figure 5 【課題】凹凸パターンを覆う液膜の乾燥時に凹凸パターンのパターン倒壊を抑制できる、技術を提供する。【解決手段】基板の凹凸パターンが形成された面を上に向けて、前記基板を保持する基板保持部と、前記基板保持部に保持されている前記基板に対し上方から処理液を供給することにより、前記凹凸パターンの凹部を覆う液膜を形成する液供給ユニットと、前記液膜を局所的に加熱する加熱部、および前記加熱部が加熱する加熱位置を移動させる加熱位置移動部を有する加熱ユニットと、前記加熱ユニットを制御する加熱制御部とを備え、前記加熱制御部は、前記凹部の深さ方向全体が前記処理液から露出した露出部と前記凹部の深さ方向全体が前記処理液で満たされた被覆部との境界部に対し鉛直方向視で前記加熱位置を重ねながら、前記露出部を拡大させる方向であって前記境界部の移動方向に前記加熱位置を移動させる、基板処理装置。【選択図】図５