MOUNTING DEVICE AND MOUNTING METHOD

To realize a mounting device capable of recognizing the target of an object to be joined of the upper layer and the target of an object to be joined of the lower layer, and capable of joining objects to be joined of multiple layers.SOLUTION: A mounting device 1 has a bonding stage 37 for holding a wiring board 2, i.e., an object to be joined of the lowermost layer, a bonding tool 42 for holding a semiconductor chip 3, i.e., an object to be joined of the upper layer joining to the wiring board 2, and a vertical two fields of view recognition optical system 12 having lower layer recognition means for recognizing the target 66 of the wiring board 2, and upper layer recognition means 16 for recognizing the target 69 of the semiconductor chip 3. The vertical two fields of view recognition optical system 12 has a first illumination unit 22 for the wiring board 2 and a second illumination unit 23 for the semiconductor chip 3, and the first illumination unit 22 and the second illumination unit 23 have a first light source 52 and a second light source 53 of different spectral wavelength ranges.SELECTED DRAWING: Figure 2 【課題】上層の被接合対象物及び下層の被接合対象物のターゲットを認識することが可能で、複数層の被接合対象物を接合することが可能な実装装置を実現すること。【解決手段】最下層の被接合対象物である配線基板２を保持するボンディングステージ３７と、配線基板２に接合する上層の被接合対象物である半導体チップ３を保持するボンディングツール４２と、配線基板２のターゲット６６を認識する下層用認識手段及び半導体チップ３のターゲット６９を認識する上層用認識手段１６を有する上下２視野認識光学系１２を有しており、上下２視野認識光学系１２は、配線基板２用の第１の照明ユニット２２及び半導体チップ３用の第２の照明ユニット２３を有し、第１の照明ユニット２２及び第２の照明ユニット２３は共に分光波長域が異なる第１の光源５２及び第２の光源５３を有している実装装置１。【選択図】図２