SOLDER JOINT ELECTRODE AND TIN ALLOY TARGET FOR COATED FILM FORMATION OF SOLDER JOINT ELECTRODE

To provide a solder joint electrode capable of reducing cost for coated film formation compared to a sputtering deposition using an alloy target mainly containing silver, and capable of providing sure solder joint without exposure of backing of a coated film formed by the sputtering deposition, and...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAGISHI KOICHI, WATANABE HIROYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ALLOYS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	To provide a solder joint electrode capable of reducing cost for coated film formation compared to a sputtering deposition using an alloy target mainly containing silver, and capable of providing sure solder joint without exposure of backing of a coated film formed by the sputtering deposition, and having a tin alloy coated film having excellent solder wettability, and a tin alloy target for coated film formation of the solder joint electrode, capable of forming the tin alloy coated film.SOLUTION: The solder joint electrode has a tin alloy coated film consisting of an alloy of tin, silver and palladium, and mainly containing tin, and containing silver of 4.0 mass% to 20 mass%, and palladium of 0.03 mass% to 0.5 mass%.SELECTED DRAWING: Figure 2 【課題】銀を主成分とする合金ターゲットを用いたスパッタリング成膜に比べて被膜形成コストを低減でき、かつ、スパッタリング成膜により形成された被膜の下地が露出せず、確実なはんだ接合が得られ、優れたはんだ濡れ性を有する錫合金被膜を有するはんだ接合電極、および、その錫合金被膜を形成することができる、はんだ接合電極の被膜形成用錫合金ターゲットの提供。【解決手段】錫と銀とパラジウムとの合金からなり、錫を主成分とし、銀が４．０質量％以上２０質量％以下、パラジウムが０．０３質量％以上０．５質量％以下の割合で含有されている錫合金被膜を有する。【選択図】図２