HEAT SINK, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR DEVICE

To provide a heat sink that is advantageous in terms of heat dissipation improvement and deformation prevention.SOLUTION: A heat sink 10 comprises: a flat plate 1 that is formed of a metal material containing copper as a main component and has a top face including mounting parts 1a for a semiconductor element; and a frame-like plate 2 that is formed of a metal material containing an iron-nickel-cobalt alloy as a main component, is located surrounding the flat plate 1 in plan view, and has inside surfaces 2 joined to outside surfaces 1b of the flat plate 1. In plan view, the dimension between an inside surface 2a of the frame-like plate 2 and an outside surface 2b facing the inside surface 2a is 7.5% or more the dimension of a flat plate 1 located between an inside surface 2a of the frame-like plate 2 and another inside surface 2a facing the inside surface 2a, and is equal to or less than a dimension obtained by subtracting 0.3 mm from the distance W between an outside surface 2b facing an inside surface 2a and an outer peripheral position of a mounting part 1a adjacent to the inside surface 2a.SELECTED DRAWING: Figure 1 【課題】放熱性向上および変形抑制について有利な放熱板等を提供すること。【解決手段】 銅を主成分とする金属材料からなり、半導体素子の搭載部１ａを含む上面を有する平板１と、鉄−ニッケル−コバルト合金を主成分とする金属材料からなり、平面視で平板１を囲んで位置しており、平板１の外側面１ｂに接合された内側面２ａを有する枠状板２とを備えており、平面視において、枠状板２の内側面２ａと内側面２ａに対向する外側面２ｂとの間の寸法が、枠状板２の内側面２ａと内側面２ａに対向する他の内側面２ａとの間に位置する平板１の寸法の7.5％以上であるとともに、内側面２ａに対向する外側面２ｂと内側面２ａに隣接する搭載部１ａの外周位置との間の距離Ｗから０．３ｍｍ差し引いた寸法以下である放熱板10等である。【選択図】図１