LIGHT-EMITTING DEVICE

To provide a light-emitting device with excellent heat dissipation.SOLUTION: A light-emitting device comprises a semiconductor laser element, and a proximal region joining a bottom with metal as chief material, and a frame part with ceramic as chief material. The proximal region has an arrangement s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAKAYASU RYO, ENOMOTO SATOSHI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a light-emitting device with excellent heat dissipation.SOLUTION: A light-emitting device comprises a semiconductor laser element, and a proximal region joining a bottom with metal as chief material, and a frame part with ceramic as chief material. The proximal region has an arrangement surface where the semiconductor laser element is placed, a frame surrounding the placed semiconductor laser element, and first and second electrode layers for electrically connecting the semiconductor laser element. The bottom has the arrangement surface, the frame part has a composition surface joining to the arrangement surface, an inside surface intersecting the composition surface and forming a frame larger than the arrangement surface, and an inside surface intersecting the composition surface and forming a frame smaller than the arrangement surface. The second electrode layer is provided on a plane intersecting at least a part of the inside surface forming a frame smaller than the arrangement surface, in the frame part, and different from the composition surface.SELECTED DRAWING: Figure 3 【課題】 放熱性に優れた発光装置を提供する。【解決手段】 発光装置は、半導体レーザ素子と、金属を主材料とする底部と、セラミックを主材料とする枠部と、が接合された基部と、を備え、基部は、半導体レーザ素子が配される配置面と、配された半導体レーザ素子の周りを囲う枠と、半導体レーザ素子を電気的に接続するための第1及び第2電極層と、を有し、底部は、配置面を有し、枠部は、配置面と接合する接合面と、接合面と交わり配置面よりも大きい枠を形成する内側面と、接合面と交わり配置面よりも小さい枠を形成する内側面と、を有し、第2電極層は、枠部において、配置面よりも小さい枠を形成する内側面の少なくとも一部と交わる平面であって、接合面とは異なる平面上に設けられる。【選択図】 図3