VACUUM DRYER, AND VACUUM DRYING METHOD

To provide a technique capable of reducing occurence of uneven drying upon drying a treatment liquid present on a base plate under vacuum.SOLUTION: A recessed part 12 is provided on a bottom face 100 of a chamber 10, and an exhaust port 14 is provided on a bottom face 120 of the recessed part 12. A...

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Bibliographische Detailangaben
1. Verfasser:	TOMIFUJI YUKIO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS BLASTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING HEATING LIGHTING MECHANICAL ENGINEERING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING WEAPONS
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Beschreibung
Zusammenfassung:	To provide a technique capable of reducing occurence of uneven drying upon drying a treatment liquid present on a base plate under vacuum.SOLUTION: A recessed part 12 is provided on a bottom face 100 of a chamber 10, and an exhaust port 14 is provided on a bottom face 120 of the recessed part 12. A first distribution plate 30 is provided on a position overlapping the exhaust port 14 in a Z axis direction. A second distribution plate 40 is disposed on a position overlapping an end part (-X side end part 32a or +X side end part 32b) of the first distribution plate 30 and an inner edge (-X side edge 124a or +X side edge 124b) of the recessed part 12 in the Z axis direction. Multiple holding parts 52 hold a substrate 9 at a position (upper position L1 or lower position L2) above the second distribution plate 40.SELECTED DRAWING: Figure 3 【課題】基板上の処理液を減圧で乾燥させる際に、乾燥むらの発生を軽減する技術を提供する。【解決手段】チャンバ１０内の底面１００に凹部１２が設けられており、当該凹部１２の底面１２０に排気口１４が設けられている。排気口１４とＺ軸方向に重なる位置に第１整流板３０が設けられている。第１整流板３０の端部（−Ｘ側端部３２ａまたは＋Ｘ側端部３２ｂ）および凹部１２の凹部１２の内縁部（−Ｘ側縁部１２４ａまたは＋Ｘ側縁部１２４ｂ）とＺ軸方向に重なる位置に、第２整流板４０が設けられている。複数の保持部５２は、第２整流板４０の上方の位置（上位置Ｌ１または下位置Ｌ２）に基板９を保持する。【選択図】図３