SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD
To provide a technique by which treatment liquid can be excellently applied to a substrate which is applied with floating force and then carried.SOLUTION: A coating applicator 1 comprises: a floating stage part 3 that applies floating force to a substrate W; a carrying mechanism 5 that moves the sub...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a technique by which treatment liquid can be excellently applied to a substrate which is applied with floating force and then carried.SOLUTION: A coating applicator 1 comprises: a floating stage part 3 that applies floating force to a substrate W; a carrying mechanism 5 that moves the substrate W applied with the floating force in a first direction D1; a nozzle 61 that discharges treatment liquid toward an upper surface Wf of the floated substrate; a measurement instrument 70 that measures a position in a vertical direction of the upper surface Wf of the substrate W; and a movement mechanism 63 that moves the nozzle 61 and the measurement instrument 70. The movement mechanism 63 moves the nozzle 61 and the measurement instrument 70 so that an adhesion horizontal position, a horizontal position at which treatment liquid from the nozzle 61 adheres to the substrate W comes close to a measurement horizontal position XM1, a horizontal position in an area where the measurement instrument 70 previously measures a vertical position of the substrate W.SELECTED DRAWING: Figure 8
【課題】浮上力が付与されて搬送される基板に処理液を良好に塗布する技術を提供する。【解決手段】塗布装置1は、基板Wに浮上力を付与する浮上ステージ部3と、浮上力が付与された基板Wを第1方向D1に移動させる搬送機構5と、浮上基板の上面Wfに向けて処理液を吐出するノズル61と、基板Wの上面Wfの鉛直位置を測定する測定器70と、ノズル61および測定器70を移動させる移動機構63を備える。移動機構63は、ノズル61からの処理液が基板Wに付着する水平位置である付着水平位置が、測定器70が基板Wの鉛直位置を予め測定する領域の水平位置である測定水平位置XM1に近づくように、61ノズルおよび測定器70を移動させる。【選択図】図8 |
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