SOLDER PRINTER AND SOLDER PRINTING METHOD

To provide a solder printer capable of performing printing control in which viscosity of cream solder measured under conditions corresponding to actual solder printing is included as a control factor.SOLUTION: A solder printer 1 comprises: a viscosity measurement part 2 which discharges a solder sam...

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Bibliographische Detailangaben
Hauptverfasser: OSAWA MASAHIRO, YANAGISAWA KOHEI, HIRASAWA YOJI, NATORI TAKEJI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a solder printer capable of performing printing control in which viscosity of cream solder measured under conditions corresponding to actual solder printing is included as a control factor.SOLUTION: A solder printer 1 comprises: a viscosity measurement part 2 which discharges a solder sample 71 being contained in a container 21 from a needle 22 attached to the container, and calculates a share rate and viscosity based upon gas pressure and a gas flow rate obtained when the solder sample 71 flows; a printing part 3 which has a metal mask 31 and a squeegee 32, and prints cream solder 72 formed of the same material with the solder sample 71 on a substrate 90; printing condition setting means 4 which sets printing condition information on the printing part 3 based upon a thickness T1 and an aperture diameter D1 of the metal mask 31, and the shear rate and the viscosity; and a control part 5 which controls the printing part 3 based upon the printing condition information.SELECTED DRAWING: Figure 1 【課題】実際のはんだ印刷に対応した条件下で計測されたクリームはんだの粘度を制御因子に含めて印刷制御できる構成のはんだ印刷装置を提供する。【解決手段】はんだ印刷装置1は、容器21に収容された状態のはんだサンプル71を当該容器に付設されたニードル22から吐出させて、はんだサンプル71が流動する際のガス圧及びガス流量に基づいて、ずり速度及び粘度を算出する粘度計測部2と、メタルマスク31とスキージ32とを有し、はんだサンプル71と同一材料からなるクリームはんだ72を基板90に印刷する印刷部3と、メタルマスク31の厚みT1及び開口径D1と、前記ずり速度及び前記粘度と、に基づいて印刷部3の印刷条件情報を設定する印刷条件設定手段4と、前記印刷条件情報に基づいて印刷部3を制御する制御部5を備える。【選択図】図1