SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

To provide a semiconductor device and a method of manufacturing the same such that when a staircase structure is formed at an end part of a laminate structure, the staircase structure has less variance in size, and can be lowered in manufacturing cost.SOLUTION: A semiconductor device according to the present embodiment comprises a substrate, and a plurality of conductive layers and a plurality of insulation layers laminated on the substrate. The laminate structure consisting of the plurality of conductive layers and the plurality of insulation layers has a staircase structure including the conductive layers as treads of respective steps. The staircase structure has a step pair of a first step part and a second step part where footstep risers of the respective steps face each other. A plurality of step pairs are provided in steps at different heights of the staircase structure.SELECTED DRAWING: Figure 4 【課題】積層構造の端部に階段構造を形成する際に、階段構造の寸法のばらつきが少なく、かつ、製造コストを低下させることができる半導体装置およびその製造方法を提供する。【解決手段】本実施形態による半導体装置は、基板と、基板の上方に積層された複数の導電層および複数の絶縁層とを備える。複数の導電層および複数の絶縁層からなる積層構造の端部は導電層を各段の踏面とする階段構造を有する。階段構造は、各段の蹴込が互いに向き合う第１段差部と第２段差部との段差対を有する。複数の段差対が階段構造において異なる高さに階段状に設けられている。【選択図】図４