SOLUBLE AND INSOLUBLE PARTICLE-CONTAINING CURABLE RESIN COMPOSITION

To provide: novel technical means capable of conveniently, easily, efficiently and productively adjusting the roughness of a cured resin layer; and novel technical means capable of forming a printed wiring board which comprises a cured resin layer with excellent coating properties (such as the insulation, heat resistance, moisture resistance, heating-cooling cycle resistance, and linear expansion coefficient), causes little reduction in the circuit width, and prevents needless plating from remaining between circuits.SOLUTION: A curable resin composition contains, based on 100 pts.mass of an epoxy resin, 4-16 pts.mass of a curative, 30-200 pts.mass of soluble particles having an average particle size of 1-3 μm, and 30-150 pts.mass of insoluble particles having an average particle size of 10-20 μm.SELECTED DRAWING: None 【課題】 硬化樹脂層の粗度を、簡便、容易、且つ効率・生産的に調整できる、新規な技術的手段を提供することを目的とする。更に、優れた塗膜特性（絶縁性、耐熱性、耐湿性、冷熱サイクル耐性、線膨張率等）を有する硬化樹脂層を備え、回路幅の減少が少なく、且つ回路間に不要なメッキが残存しない、プリント配線板を作製することができる、新規な技術的手段を提供することを目的とする。【解決手段】 エポキシ樹脂１００質量部に対し、硬化剤４〜１６質量部、平均粒径１〜３μｍの溶解性粒子３０〜２００質量部、平均粒径１０〜２０μｍの非溶解性粒子３０〜１５０質量部を含有する、ことを特徴とする硬化性樹脂組成物。【選択図】なし