METAL COMPONENT MANUFACTURING DEVICE AND METAL COMPONENT MANUFACTURING METHOD

To provide a progressive forging device and a progressive forging method with high processing tolerance and high productivity.SOLUTION: A metal component manufacturing device comprising: a transport mechanism (1) which delivers a belt-like metal plate (11) in a prescribed direction; and a forging me...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YAMADA RYOICHI, IWATA SHIGEHIRO, TERAKATA YASUO
Format: Patent
Sprache:eng ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:To provide a progressive forging device and a progressive forging method with high processing tolerance and high productivity.SOLUTION: A metal component manufacturing device comprising: a transport mechanism (1) which delivers a belt-like metal plate (11) in a prescribed direction; and a forging mechanism part (3) comprising plural metal molds (31, 32) which are located along a feed direction of the belt-like metal plate (11) at an interval same as a feed pitch. This device does not comprise a mechanism for temperature control of the belt-like metal plate (11), and comprises a mechanism for temperature control of only specific metal mold (31) of the forging mechanism part (3). A metal mold temperature is maintained at 200°C or more and 400°C or less by a temperature control mechanism. A thickness of the belt-like metal plate (11) is 10 mm or less.SELECTED DRAWING: Figure 2 【課題】加工精度、生産性が高い順送鍛造加工装置及び順送鍛造加工方法を提供する。【解決手段】 帯状金属板(11)を所定方向に送り出す搬送機構(1)と、帯状金属板(11)の送り方向に沿って送りピッチと同じ間隔で配置された複数の金型(31,32)からなる鍛造機構部(3)とを備える金属部品製造装置であって、帯状金属板(11)を温度制御する機構を備えず、かつ鍛造機構部(3)の特定の金型(31)のみに温度制御する機構を備える金属部品製造装置である。金型温度は温度制御機構により200℃以上400℃以下り維持される。帯状金属板(11)の厚みは10mm以下である。【選択図】図2