SOLDERING DEVICE AND SOLDERING METHOD
To provide a soldering device which can shorten a soldering process time.SOLUTION: A soldering device 1, which can perform soldering onto a substrate 3, comprises: a pallet 10 on which the substrate 3 can be loaded; a transfer robot 20 which can transfer the pallet 10 in a state inclined with respec...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HIROSE MAYU |
| description | To provide a soldering device which can shorten a soldering process time.SOLUTION: A soldering device 1, which can perform soldering onto a substrate 3, comprises: a pallet 10 on which the substrate 3 can be loaded; a transfer robot 20 which can transfer the pallet 10 in a state inclined with respect to a top and bottom direction; a solder tank 30 which accumulates a solder liquid 300 in which a prescribed soldered part of the substrate 3 can be immersed; a solder mask 40 which is positioned in a top direction of the solder tank 30; and springs 53, 63. The springs 53, 63 support the solder mask 40, and energize the solder mask 40 so that the solder mask 40 is separated from a liquid level 31 of the solder liquid 300. In the soldering device 1, the solder mask 40 is moved following the substrate 3 when the substrate 3 contacting the solder mask 40 is moved.SELECTED DRAWING: Figure 3
【課題】 はんだ付け工程の時間を短縮可能なはんだ付け装置を提供する。【解決手段】 基板３にはんだ付けが可能なはんだ付け装置１は、基板３を搭載可能なパレット１０、パレット１０を天地方向に対して傾いた状態で搬送可能な搬送ロボット２０、基板３のはんだ付けされる所定の部位を浸漬可能なはんだ液３００を貯留するはんだ槽３０、はんだ槽３０の天方向に位置するはんだマスク４０、及び、ばね５３，６３を備える。ばね５３，６３は、はんだマスク４０を支持し、はんだマスク４０がはんだ液３００の液面３１から離れるようはんだマスク４０を付勢する。はんだ付け装置１では、はんだマスク４０は、はんだマスク４０に当接している基板３が移動すると基板３に追従して移動する。【選択図】 図３ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2019198884A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2019198884A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2019198884A3</originalsourceid><addsrcrecordid>eNrjZFAN9vdxcQ3y9HNXcHEN83R2VXD0c1FACPq6hnj4u_AwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDQ0tDSwsLCxNHY6IUAQDZsyO2</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SOLDERING DEVICE AND SOLDERING METHOD</title><source>esp@cenet</source><creator>HIROSE MAYU</creator><creatorcontrib>HIROSE MAYU</creatorcontrib><description>To provide a soldering device which can shorten a soldering process time.SOLUTION: A soldering device 1, which can perform soldering onto a substrate 3, comprises: a pallet 10 on which the substrate 3 can be loaded; a transfer robot 20 which can transfer the pallet 10 in a state inclined with respect to a top and bottom direction; a solder tank 30 which accumulates a solder liquid 300 in which a prescribed soldered part of the substrate 3 can be immersed; a solder mask 40 which is positioned in a top direction of the solder tank 30; and springs 53, 63. The springs 53, 63 support the solder mask 40, and energize the solder mask 40 so that the solder mask 40 is separated from a liquid level 31 of the solder liquid 300. In the soldering device 1, the solder mask 40 is moved following the substrate 3 when the substrate 3 contacting the solder mask 40 is moved.SELECTED DRAWING: Figure 3
【課題】 はんだ付け工程の時間を短縮可能なはんだ付け装置を提供する。【解決手段】 基板３にはんだ付けが可能なはんだ付け装置１は、基板３を搭載可能なパレット１０、パレット１０を天地方向に対して傾いた状態で搬送可能な搬送ロボット２０、基板３のはんだ付けされる所定の部位を浸漬可能なはんだ液３００を貯留するはんだ槽３０、はんだ槽３０の天方向に位置するはんだマスク４０、及び、ばね５３，６３を備える。ばね５３，６３は、はんだマスク４０を支持し、はんだマスク４０がはんだ液３００の液面３１から離れるようはんだマスク４０を付勢する。はんだ付け装置１では、はんだマスク４０は、はんだマスク４０に当接している基板３が移動すると基板３に追従して移動する。【選択図】 図３</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHAMBERS PROVIDED WITH MANIPULATION DEVICES ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HAND TOOLS ; MACHINE TOOLS ; MANIPULATORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PORTABLE POWER-DRIVEN TOOLS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191121&DB=EPODOC&CC=JP&NR=2019198884A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191121&DB=EPODOC&CC=JP&NR=2019198884A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIROSE MAYU</creatorcontrib><title>SOLDERING DEVICE AND SOLDERING METHOD</title><description>To provide a soldering device which can shorten a soldering process time.SOLUTION: A soldering device 1, which can perform soldering onto a substrate 3, comprises: a pallet 10 on which the substrate 3 can be loaded; a transfer robot 20 which can transfer the pallet 10 in a state inclined with respect to a top and bottom direction; a solder tank 30 which accumulates a solder liquid 300 in which a prescribed soldered part of the substrate 3 can be immersed; a solder mask 40 which is positioned in a top direction of the solder tank 30; and springs 53, 63. The springs 53, 63 support the solder mask 40, and energize the solder mask 40 so that the solder mask 40 is separated from a liquid level 31 of the solder liquid 300. In the soldering device 1, the solder mask 40 is moved following the substrate 3 when the substrate 3 contacting the solder mask 40 is moved.SELECTED DRAWING: Figure 3
【課題】 はんだ付け工程の時間を短縮可能なはんだ付け装置を提供する。【解決手段】 基板３にはんだ付けが可能なはんだ付け装置１は、基板３を搭載可能なパレット１０、パレット１０を天地方向に対して傾いた状態で搬送可能な搬送ロボット２０、基板３のはんだ付けされる所定の部位を浸漬可能なはんだ液３００を貯留するはんだ槽３０、はんだ槽３０の天方向に位置するはんだマスク４０、及び、ばね５３，６３を備える。ばね５３，６３は、はんだマスク４０を支持し、はんだマスク４０がはんだ液３００の液面３１から離れるようはんだマスク４０を付勢する。はんだ付け装置１では、はんだマスク４０は、はんだマスク４０に当接している基板３が移動すると基板３に追従して移動する。【選択図】 図３</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHAMBERS PROVIDED WITH MANIPULATION DEVICES</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HAND TOOLS</subject><subject>MACHINE TOOLS</subject><subject>MANIPULATORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PORTABLE POWER-DRIVEN TOOLS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAN9vdxcQ3y9HNXcHEN83R2VXD0c1FACPq6hnj4u_AwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDQ0tDSwsLCxNHY6IUAQDZsyO2</recordid><startdate>20191121</startdate><enddate>20191121</enddate><creator>HIROSE MAYU</creator><scope>EVB</scope></search><sort><creationdate>20191121</creationdate><title>SOLDERING DEVICE AND SOLDERING METHOD</title><author>HIROSE MAYU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2019198884A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2019</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHAMBERS PROVIDED WITH MANIPULATION DEVICES</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HAND TOOLS</topic><topic>MACHINE TOOLS</topic><topic>MANIPULATORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PORTABLE POWER-DRIVEN TOOLS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>HIROSE MAYU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIROSE MAYU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOLDERING DEVICE AND SOLDERING METHOD</title><date>2019-11-21</date><risdate>2019</risdate><abstract>To provide a soldering device which can shorten a soldering process time.SOLUTION: A soldering device 1, which can perform soldering onto a substrate 3, comprises: a pallet 10 on which the substrate 3 can be loaded; a transfer robot 20 which can transfer the pallet 10 in a state inclined with respect to a top and bottom direction; a solder tank 30 which accumulates a solder liquid 300 in which a prescribed soldered part of the substrate 3 can be immersed; a solder mask 40 which is positioned in a top direction of the solder tank 30; and springs 53, 63. The springs 53, 63 support the solder mask 40, and energize the solder mask 40 so that the solder mask 40 is separated from a liquid level 31 of the solder liquid 300. In the soldering device 1, the solder mask 40 is moved following the substrate 3 when the substrate 3 contacting the solder mask 40 is moved.SELECTED DRAWING: Figure 3
【課題】 はんだ付け工程の時間を短縮可能なはんだ付け装置を提供する。【解決手段】 基板３にはんだ付けが可能なはんだ付け装置１は、基板３を搭載可能なパレット１０、パレット１０を天地方向に対して傾いた状態で搬送可能な搬送ロボット２０、基板３のはんだ付けされる所定の部位を浸漬可能なはんだ液３００を貯留するはんだ槽３０、はんだ槽３０の天方向に位置するはんだマスク４０、及び、ばね５３，６３を備える。ばね５３，６３は、はんだマスク４０を支持し、はんだマスク４０がはんだ液３００の液面３１から離れるようはんだマスク４０を付勢する。はんだ付け装置１では、はんだマスク４０は、はんだマスク４０に当接している基板３が移動すると基板３に追従して移動する。【選択図】 図３</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; jpn |
| recordid | cdi_epo_espacenet_JP2019198884A |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHAMBERS PROVIDED WITH MANIPULATION DEVICES CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND TOOLS MACHINE TOOLS MANIPULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PORTABLE POWER-DRIVEN TOOLS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | SOLDERING DEVICE AND SOLDERING METHOD |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-31T16%3A27%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HIROSE%20MAYU&rft.date=2019-11-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2019198884A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |