POLISHING APPARATUS COMPRISING SURFACE TEXTURE MEASUREMENT DEVICE FOR ABRASIVE PAD, AND POLISHING SYSTEM

To provide a polishing apparatus, the throughput of which can be increased by automatically measuring surface texture of an abrasive pad.SOLUTION: A polishing apparatus comprises a surface texture measurement device 30 that measures surface texture of an abrasive pad 2, a support arm 50 that support...

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Bibliographische Detailangaben
Hauptverfasser:	KAMIKI KEISUKE, MARUYAMA TORU, MOTOJIMA YASUYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a polishing apparatus, the throughput of which can be increased by automatically measuring surface texture of an abrasive pad.SOLUTION: A polishing apparatus comprises a surface texture measurement device 30 that measures surface texture of an abrasive pad 2, a support arm 50 that supports the surface texture measurement device 30, and a movement unit 53 that is connected to the support arm 50 and that automatically moves the surface texture measurement device 30 to a measurement position from a retreat position.SELECTED DRAWING: Figure 9 【課題】自動で研磨パッドの表面性状を測定して、研磨装置のスループットを向上させることが可能な研磨装置を提供する。【解決手段】研磨装置は、研磨パッド２の表面性状を測定する表面性状測定装置３０と、表面性状測定装置３０を支持する支持アーム５０と、支持アーム５０に連結され、表面性状測定装置３０を待避位置から測定位置に自動で移動させる移動ユニット５３と、を備える。【選択図】図９