ASSEMBLING APPARATUS AND ASSEMBLING METHOD OF SEMICONDUCTOR MANUFACTURING APPARATUS

To provide a technique capable of shortening an assembly period of a semiconductor manufacturing apparatus.SOLUTION: The assembly apparatus for a semiconductor manufacturing apparatus includes a reaction tube having an opening at a lower end. The assembly apparatus has a body, a lifting mechanism fo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	INOUE HISASHI, KUMAGAI YOSHIHISA, HATAKEYAMA TAMOTSU, KOBAYASHI MASATOSHI, TAKAHASHI MICHIHIRO, KIKUCHI HIROSHI, HASEGAWA AKINARI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!