ASSEMBLING APPARATUS AND ASSEMBLING METHOD OF SEMICONDUCTOR MANUFACTURING APPARATUS

To provide a technique capable of shortening an assembly period of a semiconductor manufacturing apparatus.SOLUTION: The assembly apparatus for a semiconductor manufacturing apparatus includes a reaction tube having an opening at a lower end. The assembly apparatus has a body, a lifting mechanism fo...

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Hauptverfasser:	INOUE HISASHI, KUMAGAI YOSHIHISA, HATAKEYAMA TAMOTSU, KOBAYASHI MASATOSHI, TAKAHASHI MICHIHIRO, KIKUCHI HIROSHI, HASEGAWA AKINARI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	To provide a technique capable of shortening an assembly period of a semiconductor manufacturing apparatus.SOLUTION: The assembly apparatus for a semiconductor manufacturing apparatus includes a reaction tube having an opening at a lower end. The assembly apparatus has a body, a lifting mechanism for holding and lifting the reaction tube, a gas supply mechanism for supplying a gas into the reaction tube, and an exhaust mechanism for exhausting an inside of the reaction tube.SELECTED DRAWING: Figure 3 【課題】半導体製造装置の組立工期を短縮することができる技術を提供する。【解決手段】本開示の一態様による半導体製造装置の組立装置は、下端に開口を有する反応管を備える半導体製造装置の組立装置であって、本体と、前記本体に取り付けられ、前記反応管を保持して昇降させる昇降機構と、前記反応管の内部にガスを供給するガス供給機構と、前記反応管の内部を排気する排気機構と、を有する。【選択図】図３