SEMICONDUCTOR DEVICE
To suppress variations in electric characteristics of a temperature sense diode built into a semiconductor device.SOLUTION: A semiconductor device disclosed in the present specification comprises a semiconductor element including a temperature sense diode, a conductor plate arranged with the semicon...
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| Sprache: | eng ; jpn |
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| Zusammenfassung: | To suppress variations in electric characteristics of a temperature sense diode built into a semiconductor device.SOLUTION: A semiconductor device disclosed in the present specification comprises a semiconductor element including a temperature sense diode, a conductor plate arranged with the semiconductor element, and a sealing body integrally holding the semiconductor element and the conductor plate. In this semiconductor device, when viewed in a thickness direction of the sealing body, the semiconductor element is arranged so that a direction of current flowing in the temperature sense diode inclines to each side of a rectangular outer peripheral edge of the sealing body.SELECTED DRAWING: Figure 2
【課題】半導体装置に組み込まれた温度センス用ダイオードの電気特性のばらつきを抑制する。【解決手段】本明細書が開示する半導体装置は、温度センス用ダイオードを有する半導体素子と、半導体素子が配置された導体板と、半導体素子と導体板とを一体に保持する封止体とを備える。この半導体装置では、封止体の厚み方向に沿って平面視したときに、温度センス用ダイオード内を流れる電流の向きが、封止体の矩形状の外周縁の各辺に対して傾くように、半導体素子が配置されている。【選択図】図２ |
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