NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND MANUFACTURING METHOD OF THE SAME, AND SEMICONDUCTOR DEVICE USING NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND MANUFACTURING METHOD OF THE SAME

To provide a noble metal-coated silver bonding wire that suppresses corrosion at a bonding interface even under high temperature and high humidity conditions and causes no energization failure.SOLUTION: The noble metal-coated silver wire for ball bonding includes a noble metal-coated layer on a core material made of pure silver or a silver alloy. The wire includes at least one sulfur group element. The noble metal-coated layer includes a palladium intermediate layer and a gold skin layer. A content of palladium with respect to the entire wire is 0.01 mass% or more and 5.0 mass% or less. A gold content with respect to the entire wire is 1.0 mass% or more and 6.0 mass% or less. A content of the sulfur group element with respect to the entire wire is 0.1 mass ppm or more and 100 mass ppm or less.SELECTED DRAWING: None 【課題】高温高湿の条件下でも接合界面の腐食を抑制し、通電不良が生じない貴金属被覆銀ボンディングワイヤを提供する。【解決手段】純銀または銀合金からなる芯材上に貴金属被覆層を備えたボールボンディング用貴金属被覆銀ワイヤにおいて、ワイヤが少なくとも１種の硫黄族元素を含み、貴金属被覆層がパラジウム中間層および金表皮層を備える。ワイヤ全体に対するパラジウムの含有量が０．０１質量％以上５．０質量％以下であり、ワイヤ全体に対する金の含有量が１．０質量％以上６．０質量％以下であり、かつ、ワイヤ全体に対する硫黄族元素の含有量が０．１質量ｐｐｍ以上１００質量ｐｐｍ以下である。【選択図】なし