PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARD

To provide a photosensitive resin composition excellent in a coating property and a film forming property as well as excellent in developability and resolution and capable of improving productivity of a dry film.SOLUTION: The photosensitive resin composition of the present invention comprises a carb...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: UEDA CHIHO, TAKII YOJI, OKADA KAZUYA, YODA KENJI, SUZUKI ERI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:To provide a photosensitive resin composition excellent in a coating property and a film forming property as well as excellent in developability and resolution and capable of improving productivity of a dry film.SOLUTION: The photosensitive resin composition of the present invention comprises a carboxyl group-containing resin A having a weight average molecular weight of 1500 or more and less than 5000, a carboxyl group-containing resin B having a weight average molecular weight of 5000 or more and 150000 or less, an epoxy resin, a photopolymerization initiator, a photosensitive monomer, and an inorganic filler, in which a compounding ratio of the carboxyl group-containing resin A to the carboxyl group-containing resin B is 6:4 to 3:7 on a mass basis, and the content of the inorganic filler is 40 to 300 parts with respect to 100 parts of the carboxyl group-containing resin included in the photosensitive resin composition.SELECTED DRAWING: None 【課題】塗工性および製膜性に優れると共に、現像性および解像性に優れ、ドライフィルムの生産性を向上させることのできる、感光性樹脂組成物の提供。【解決手段】本発明による感光性樹脂組成物は、重量平均分子量が、1500以上、5000未満のカルボキシル基含有樹脂Aと、重量平均分子量が、5000以上、150000以下のカルボキシル基含有樹脂Bと、エポキシ樹脂と、光重合開始剤と、感光性モノマーと、無機フィラーと、を含み、カルボキシル基含有樹脂Aと、カルボキシル基含有樹脂Bとの配合比が、質量基準で、6:4〜3:7であり、前記無機フィラーの含有量が、感光性樹脂組成物に含まれるカルボキシル基含有樹脂100部に対し、40〜300部であることを特徴とする。【選択図】なし