THERMOSETTING ADHESIVE COMPOSITION FOR ELECTRONIC COMPONENT, AND THERMOSETTING ADHESIVE SHEET FOR ELECTRONIC COMPONENT
To provide an adhesive sheet making handleability in atmosphere at a room temperature or higher easy.SOLUTION: There is provided a thermosetting adhesive composition for electronic component containing at least a thermoplastic resin (A), a thermosetting resin (B), and an inorganic filler (C), the th...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide an adhesive sheet making handleability in atmosphere at a room temperature or higher easy.SOLUTION: There is provided a thermosetting adhesive composition for electronic component containing at least a thermoplastic resin (A), a thermosetting resin (B), and an inorganic filler (C), the thermoplastic resin (A) is a (meth)acrylic resin, blended amount of the thermoplastic resin (A) is 45.0 to 80.0 mass% based on total mass of the adhesive composition, and average primary particle diameter of the inorganic filler (C) is 0.005 to 1.0 μm.SELECTED DRAWING: None
【課題】室温以上雰囲気における取り扱い性を容易にさせた接着剤シートを提供する。【解決手段】少なくとも熱可塑性樹脂(A)、熱硬化性樹脂(B)および無機充填材(C)を含有する電子部品用熱硬化型接着剤組成物であって、熱可塑性樹脂(A)が(メタ)アクリル系樹脂であり、熱可塑性樹脂(A)の配合量が接着剤組成物の全質量に対して45.0〜80.0質量%であり、かつ無機充填材(C)の平均1次粒径が0.005〜1.0μmであることを特徴とする電子部品用熱硬化型接着剤組成物。【選択図】 なし |
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