METAL-RESIN BONDED PRODUCT

To provide a metal-resin bonded product with a high joint strength.SOLUTION: A metal-resin bonded product comprises; a metal part with a plating layer on its surface and a resin part bonded to the metal part via the plating layer. The plating layer has a surface layer part made up of column crystals which extend in a thickness, and which are oriented to {110}, and a surface roughness (Ra) of the plating layer is 0.3 μm or more. The plating layer has a lower layer part which is arranged under the surface layer part, and which is made of fine crystals with an average particle size of 50-500 nm. It is preferable that an average height of the column crystal is 1-6 μm and that an average width is 50 nm-2 μm. The plating layer of this sort is obtained, for example, by plating process in which electric current with a density 0.5-1 A/dm2 is applied to the metal part dipped in a plating bath without stirring.SELECTED DRAWING: Figure 3 【課題】接合強度の高い金属樹脂接合体を提供する。【解決手段】本発明は、めっき層を表面に有する金属体と、そのめっき層を介して金属体に接合された樹脂体とを備える金属樹脂接合体である。めっき層は、厚さ方向に延びる｛１１０｝に配向した柱状結晶からなる表層部を有し、めっき層の表面粗さ（Ｒａ）は０．３μｍ以上である。めっき層は、さらに、平均粒径が５０〜５００ｎｍである微結晶からなる下層部を表層部下に有する。柱状結晶は、平均高さが１〜６μｍで平均幅が５０ｎｍ〜２μｍであると好ましい。このようなめっき層は、例えば、めっき浴の撹拌を行わずに、めっき浴に浸漬した金属体へ電流密度が０．５〜１Ａ／ｄｍ２となる通電を行うめっき工程により得られる。【選択図】図３