DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARD

To provide a dry film that achieves excellent reliability as a cured product, while having excellent slit workability and handleability, and excellent laminate properties, and a cured product and a printed wiring board.SOLUTION: The present invention provides a dry film containing a support film, a...

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Bibliographische Detailangaben
Hauptverfasser:	TAKII YOJI, YODA KENJI, ITO NOBUHITO, OKAYASU KATSUKI, KITAMURA TARO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a dry film that achieves excellent reliability as a cured product, while having excellent slit workability and handleability, and excellent laminate properties, and a cured product and a printed wiring board.SOLUTION: The present invention provides a dry film containing a support film, a protection film, and a resin layer sandwiched between the support film and protection film, the resin layer containing (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) spherical silica, and (D) an epoxy resin. In a solid content of a curable resin composition used for a resin layer, a content of the (C) spherical silica is 50 mass% or more; the total content of one or more epoxy resins blended in a liquid form, of (D) the epoxy resin, is 20 mass% or more of the total amount of the (D) epoxy resin.SELECTED DRAWING: None 【課題】硬化物としての優れた信頼性を実現しつつ、スリット加工性や取扱い性に優れ、かつ優れたラミネート性を備えるドライフィルム、硬化物およびプリント配線板を提供する。【解決手段】支持フィルムと、保護フィルムと、支持フィルムと保護フィルムとの間に挟まれた樹脂層とを有するドライフィルムであって、樹脂層は、（Ａ）カルボキシル基含有樹脂と、（Ｂ）光重合開始剤と、（Ｃ）球状シリカと、（Ｄ）エポキシ樹脂と、を含み、樹脂層に用いられる硬化性樹脂組成物の固形分中の前記（Ｃ）球状シリカの含有量が、５０質量％以上であり、（Ｄ）エポキシ樹脂のうち液体で配合される１種以上のエポキシ樹脂の量の合計が、（Ｄ）エポキシ樹脂量全体の２０質量％以上であることを特徴とする。【選択図】なし