CURABLE RESIN COMPOSITION, DRY FILM COMPOSED OF THE COMPOSITION, CURED PRODUCT AND PRINTED WIRING BOARD HAVING THE CURED PRODUCT

To provide a curable resin composition that has excellent resolution even when filled with spherical silica, and is also excellent in high-temperature and high-humidity resistance (PCT resistance) and thermal cycle resistance (TCT resistance) of a cured product, a dry film composed of the compositio...

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Bibliographische Detailangaben
Hauptverfasser:	TAKII YOJI, YODA KENJI, ITO NOBUHITO, OKAYASU KATSUKI, KITAMURA TARO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a curable resin composition that has excellent resolution even when filled with spherical silica, and is also excellent in high-temperature and high-humidity resistance (PCT resistance) and thermal cycle resistance (TCT resistance) of a cured product, a dry film composed of the composition, a cured product thereof, and a printed wiring board having the cured product.SOLUTION: The present invention provides a curable resin composition containing (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) an epoxy resin, and (D) inorganic filler, the (C) epoxy resin comprising an epoxy resin having a biphenyl skeleton, and other epoxy resins being solid or semisolid at normal temperature, the (D) inorganic filler comprising spherical silica and barium sulfate, with a compounding ratio of the spherical silica and barium sulfate being 1: (0.5-5) in volume ratio.SELECTED DRAWING: None 【課題】球状シリカを充填しても解像性に優れ、しかも、硬化物の高温高湿耐性（ＰＣＴ耐性）や冷熱サイクル耐性（ＴＣＴ耐性）に優れる硬化性樹脂組成物、該組成物からなるドライフィルム、これらの硬化物、および、該硬化物を有するプリント配線板を提供する。【解決手段】（Ａ）カルボキシル基含有樹脂、（Ｂ）光重合開始剤、（Ｃ）エポキシ樹脂、および（Ｄ）無機フィラーを含有する硬化性樹脂組成物であって、（Ｃ）エポキシ樹脂として、ビフェニル骨格を有するエポキシ樹脂とそれ以外の常温で固形または半固形のエポキシ樹脂とを含有し、（Ｄ）無機フィラーとして、球状シリカと硫酸バリウムを含有し、球状シリカと硫酸バリウムの配合割合が、体積比で１：（０．５〜５）であることを特徴とする。【選択図】なし